Please use this identifier to cite or link to this item: http://hdl.handle.net/123456789/3631
Title: Optimization of wood saw dust (WSD) as pore forming agent for porous ceramic using response surface methodology (RSM) statistical design
Authors: Kechik A.A. 
Tharmizi N.A.M. 
Arlina, A. 
Taib M.A.A. 
Mohamad M. 
Boon, J.G. 
Masri M.N. 
Mohamed, J. J. 
Zakaria S.K. 
Teo, P.T. 
Keywords: Wood saw dust (WSD);response surface methodology (RSM);porous ceramic
Issue Date: 2022
Publisher: American Institute of Physics Inc.
Conference: AIP Conference Proceedings 
Abstract: 
Wood saw dust (WSD) is a byproduct of the wood and forestry industries. Because of its small and homogeneous particle size distribution and considerably lower ignition point, WSD was chosen as a pore producing agentIn this work, a statistical design based on response surface methodology (RSM) was used to optimise the amount of WSD supplied and the sintering temperature for the porous ceramic. RSM with Central Composite Design (CCD) statistical analysis, including model adequacy testing, analysis of variance (ANOVA), and interaction plot. CCD discovered by statistical research that the weight percent of WSD added and the sintering temperature have a substantial impact on the final characteristics of the clay-based ceramic integrated with the WSD. The findings of the statistical study were likewise hugely important and validated for the ceramics. The porous ceramic material was then created by combining kaolin clay and WSD, the composition of which varied from 0 wt.% to 50 wt.%. X-Ray Diffraction (XRD), Scanning Electron Microscopy (SEM), and compressive strength are then used to describe the porous ceramic sample. Moreover, such a combination of products results in a more porous microstructure of the burned clay. The ideal sintering temperature and mixture were 1000 °C and 25% WSD, respectively.
Description: 
Scopus
URI: http://hdl.handle.net/123456789/3631
ISBN: 978-073544193-4
ISSN: 0094243X
DOI: 10.1063/5.0078327
Appears in Collections:Faculty of Bioengineering and Technology - Proceedings

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