Please use this identifier to cite or link to this item:
http://hdl.handle.net/123456789/2046
Title: | Physical, thermal, mechanical, antimicrobial and physicochemical properties of starch based film containing aloe vera: a review | Authors: | Mohd Nizam N.H. Mohammad Rawi N.F. Mhd Ramle, S.F. Abd Aziz A. Abdullah C.K. Rashedi A. Mohamad Kassim M.H. |
Keywords: | Aloe vera;Antimicrobial properties;Mechanical properties;Physicochemical properties;Starch film;Thermal properties | Issue Date: | Nov-2021 | Publisher: | Elsevier Editora Ltda | Journal: | Journal of Materials Research and Technology | Abstract: | Growing consumer awareness of the importance of environmentally friendly products has resulted in the development of a number of substitutes for synthetic polymers. The starch-based film is one of the best alternatives; it is a cost-effective material that has been investigated as an excellent raw material for the production of a biodegradable film. Additionally, the development of starch-based films for use as antimicrobial packaging or coating is one of the most promising active packaging systems. Recently, interest in using aloe vera as an organic antimicrobial agent derived from plants has risen significantly. Due to its film-forming properties, antimicrobial properties, and biochemical properties, aloe vera gel has been identified as one of the best biodegradable films. Aloe vera rind also contributes to the film's exceptional properties. This review article summarises and discusses the film formation and properties of aloe vera-based starch-based films, including their physical, thermal, mechanical, antimicrobial, and physiochemical properties. |
Description: | Scopus |
URI: | http://hdl.handle.net/123456789/2046 | ISSN: | 22387854 | DOI: | 10.1016/j.jmrt.2021.08.138 |
Appears in Collections: | Faculty of Bioengineering and Technology - Journal (Scopus/WOS) |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
S2238785421009637.pdf | 1.79 MB | Adobe PDF | View/Open |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.