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http://hdl.handle.net/123456789/895| Title: | The Effect of Bismuth Addition on Sn-Ag-Cu Lead-Free Solder Properties: A Short Review | Authors: | Muhamad M. Masri, M.N. Nazeri M.F.M. Mohamad A.A. |
Keywords: | Binary alloys;Copper alloys;Electronics industry;Silver alloys;Ternary alloys;Tin alloys | Issue Date: | 28-Dec-2020 | Publisher: | IOP Publishing Ltd | Conference: | International Conference on Science and Technology 2020, ICoST 2020 | Abstract: | Sn-0.7Ag-0.5Cu lead-free solder is an alternative solder material suitable to replace Sn-Pb solder in electronic manufacturing. In this review, the change in the microstructure, elements, the structural and melting point of Sn-0.7Ag-0.5Cu after the addition of different compositions of bismuth were discovered. Besides, the influence of bismuth in lead-free solder alloys attracts to be studied due to its capability to improve the wettability and solder spread. |
Description: | Scopus |
URI: | http://hdl.handle.net/123456789/895 | ISSN: | 17551307 | DOI: | 10.1088/1755-1315/596/1/012007 |
| Appears in Collections: | Faculty of Bioengineering and Technology - Proceedings |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| The-Effect-of-Bismuth-Addition-on-SnAgCu-LeadFree-Solder-Properties-A-Short-Review2020IOP-Conference-Series-Earth-and-Environmental-Science.pdf | 772.74 kB | Adobe PDF | View/Open |
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