Please use this identifier to cite or link to this item:
http://hdl.handle.net/123456789/895| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Muhamad M. | en_US |
| dc.contributor.author | Masri, M.N. | en_US |
| dc.contributor.author | Nazeri M.F.M. | en_US |
| dc.contributor.author | Mohamad A.A. | en_US |
| dc.date.accessioned | 2021-03-08T04:53:17Z | - |
| dc.date.available | 2021-03-08T04:53:17Z | - |
| dc.date.issued | 2020-12-28 | - |
| dc.identifier.issn | 17551307 | - |
| dc.identifier.uri | http://hdl.handle.net/123456789/895 | - |
| dc.description | Scopus | en_US |
| dc.description.abstract | Sn-0.7Ag-0.5Cu lead-free solder is an alternative solder material suitable to replace Sn-Pb solder in electronic manufacturing. In this review, the change in the microstructure, elements, the structural and melting point of Sn-0.7Ag-0.5Cu after the addition of different compositions of bismuth were discovered. Besides, the influence of bismuth in lead-free solder alloys attracts to be studied due to its capability to improve the wettability and solder spread. | en_US |
| dc.description.sponsorship | UMK | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | IOP Publishing Ltd | en_US |
| dc.subject | Binary alloys | en_US |
| dc.subject | Copper alloys | en_US |
| dc.subject | Electronics industry | en_US |
| dc.subject | Silver alloys | en_US |
| dc.subject | Ternary alloys | en_US |
| dc.subject | Tin alloys | en_US |
| dc.title | The Effect of Bismuth Addition on Sn-Ag-Cu Lead-Free Solder Properties: A Short Review | en_US |
| dc.type | International | en_US |
| dc.relation.conference | International Conference on Science and Technology 2020, ICoST 2020 | en_US |
| dc.identifier.doi | 10.1088/1755-1315/596/1/012007 | - |
| dc.volume | 596 (1) | en_US |
| dc.description.articleno | 012007 | en_US |
| dc.date.seminarstartdate | 2020-09-10 | - |
| dc.date.seminarenddate | 2020-09-10 | - |
| dc.description.placeofseminar | Virtual, Online; Malaysia | en_US |
| dc.description.type | Proceeding Papers | en_US |
| item.grantfulltext | open | - |
| item.fulltext | With Fulltext | - |
| item.languageiso639-1 | en | - |
| item.openairetype | International | - |
| Appears in Collections: | Faculty of Bioengineering and Technology - Proceedings | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| The-Effect-of-Bismuth-Addition-on-SnAgCu-LeadFree-Solder-Properties-A-Short-Review2020IOP-Conference-Series-Earth-and-Environmental-Science.pdf | 772.74 kB | Adobe PDF | View/Open |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.