Reliability Analysis on the Flexible Printed Circuit Board After Reflow Soldering

Abstract

Flexible printed circuit boards (FPCB) offer several advantages; however, certain limitations, such as inadequate reflow profile, cause reliability issues in the manufacturing assembly process. This chapter details a reliability study to verify the solder joint bonding capability between the FPCB and BGA packages to withstand the pulling out load. The results revealed that the fracture mode on the FPCB occurred between the interface of the copper pad and solder joints. An increase in Ag content in the solder joints slightly improves the shear strength. Overall, the newly developed approach significantly decreased the solder joint defects and enhanced solutions to producing Pb-free solders with reduced reliability issues in the electronics manufacturing industry