1. My Scholar, Digital Library Repository, Universiti Malaysia Kelantan
  2. B- BOOK SECTION
  3. Faculty of Bioengineering and Technology - Book Section
  4. Book Sections (Scopus Indexed) - FBKT
Please use this identifier to cite or link to this item: http://hdl.handle.net/123456789/3338
DC FieldValueLanguage
dc.contributor.authorAhmad M Ien_US
dc.contributor.authorAziz M.S.A.en_US
dc.contributor.authorKhor C.Y.en_US
dc.date.accessioned2022-09-19T02:14:49Z-
dc.date.available2022-09-19T02:14:49Z-
dc.date.issued2022-
dc.identifier.issn23643293-
dc.identifier.urihttp://hdl.handle.net/123456789/3338-
dc.descriptionScopusen_US
dc.description.abstractFlexible printed circuit boards (FPCB) offer several advantages; however, certain limitations, such as inadequate reflow profile, cause reliability issues in the manufacturing assembly process. This chapter details a reliability study to verify the solder joint bonding capability between the FPCB and BGA packages to withstand the pulling out load. The results revealed that the fracture mode on the FPCB occurred between the interface of the copper pad and solder joints. An increase in Ag content in the solder joints slightly improves the shear strength. Overall, the newly developed approach significantly decreased the solder joint defects and enhanced solutions to producing Pb-free solders with reduced reliability issues in the electronics manufacturing industryen_US
dc.description.sponsorshipFaculty of Bioengineering and Technology, Universiti Malaysia Kelantanen_US
dc.language.isoen_USen_US
dc.publisherSpringer Science and Business Media Deutschland GmbHen_US
dc.relation.ispartofTopics in Mining, Metallurgy and Materials Engineeringen_US
dc.subjectFlexible printed circuit boarden_US
dc.subjectReflow solderingen_US
dc.subjectTensile testen_US
dc.titleReliability Analysis on the Flexible Printed Circuit Board After Reflow Solderingen_US
dc.typeInternationalen_US
dc.identifier.doi10.1007/978-3-030-93441-5_13-
dc.description.fundingFRGS/1/2020/TK0/USM/03/6en_US
dc.description.page283 - 298en_US
dc.description.typeChapter in Booken_US
item.fulltextNo Fulltext-
item.openairetypeInternational-
item.languageiso639-1en_US-
item.grantfulltextnone-
crisitem.author.deptUniversiti Malaysia Kelantan-
Appears in Collections:Book Sections (Scopus Indexed) - FBKT
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