Please use this identifier to cite or link to this item:
http://hdl.handle.net/123456789/792| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Mohd Tarmizi, F.S. | en_US |
| dc.contributor.author | Masri M.N. | en_US |
| dc.contributor.author | Mohd Nazeri, M.F. | en_US |
| dc.contributor.author | Mohamad, A.A. | en_US |
| dc.date.accessioned | 2021-03-04T03:42:52Z | - |
| dc.date.available | 2021-03-04T03:42:52Z | - |
| dc.date.issued | 2020-12-28 | - |
| dc.identifier.issn | 17551307 | - |
| dc.identifier.uri | http://hdl.handle.net/123456789/792 | - |
| dc.description | Scopus | en_US |
| dc.description.abstract | Sn-0.7Cu lead-free solder is an alternative solder material that suitable to replace Sn-Pb solder in electronic manufacturing. However, it has a weakness of high melting temperature and lower mechanical strength. In this study, the change in microstructure, elements, the structural and melting point of Sn-0.7Cu after the addition of different compositions of Zn element was discussed. The result shows that after adding a small amount of Zn, a refinement microstructure of Sn-0.7Cu-xZn solder alloy was obtained, and the melting point of the solder decreased from 227.7 °C to 225.7 °C. Besides, the formation new phase of was investigated by scanning electron microscope (SEM) followed by energy-dispersive X-ray spectroscopy (EDX) and X-ray diffraction (XRD). Besides, the behaviour of Sn-0.7Cu-xZn solder alloy can be further studied via open circuit potential (OCP) to determine the corrosion potential. | en_US |
| dc.description.sponsorship | Universiti Malaysia Kelantan | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | IOP Publishing Ltd | en_US |
| dc.relation.ispartof | IOP Conference Series: Earth and Environmental Science | en_US |
| dc.subject | Binary alloys | en_US |
| dc.subject | Copper corrosion | en_US |
| dc.subject | Copper metallography | en_US |
| dc.subject | Electronics industry | en_US |
| dc.subject | Energy dispersive spectroscopy | en_US |
| dc.title | Effect Additions Zn on Sn-0.7Cu Lead-Free Solder: A Short Brief | en_US |
| dc.type | International | en_US |
| dc.relation.conference | International Conference on Science and Technology 2020, ICoST 2020 | en_US |
| dc.identifier.doi | 10.1088/1755-1315/596/1/012038 | - |
| dc.volume | 596 (1) | en_US |
| dc.description.articleno | 012038 | en_US |
| dc.date.seminarstartdate | 2020-09-10 | - |
| dc.date.seminarenddate | 2020-09-10 | - |
| dc.description.placeofseminar | Malaysia | en_US |
| dc.description.type | Proceeding Papers | en_US |
| item.openairetype | International | - |
| item.fulltext | With Fulltext | - |
| item.languageiso639-1 | en | - |
| item.grantfulltext | open | - |
| Appears in Collections: | Faculty of Bioengineering and Technology - Proceedings | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Effect-Additions-Zn-on-Sn07Cu-LeadFree-Solder-A-Short-Brief2020IOP-Conference-Series-Earth-and-Environmental-Science.pdf | 551.35 kB | Adobe PDF | View/Open |
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