Please use this identifier to cite or link to this item:
http://hdl.handle.net/123456789/5808
DC Field | Value | Language |
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dc.contributor.author | Ishak M.H.H. | en_US |
dc.contributor.author | Aziz, M. S. A. | en_US |
dc.contributor.author | Ahmad M I | en_US |
dc.contributor.author | Khor C.Y. | en_US |
dc.contributor.author | Siahaan E. | en_US |
dc.date.accessioned | 2024-01-23T09:21:15Z | - |
dc.date.available | 2024-01-23T09:21:15Z | - |
dc.date.issued | 2023 | - |
dc.identifier.issn | 0094243X | - |
dc.identifier.uri | http://hdl.handle.net/123456789/5808 | - |
dc.description | Scopus | en_US |
dc.description.abstract | High demands on flexibility, lighter weight, thinner size and low-cost electronic product had increased the application of Flexible Printed Circuit Board (FPCB) over Rigid Printed Circuit Board (RPCB). However, the thermal factor affects FPCB significantly during the reflow soldering process. The temperature of the reflow soldering process causes the FPCB to encounter significant deflection and thermal stress compared to the RPCB. Therefore, the present experiment investigates the effect of temperature on FPCB layout during the reflow soldering process. The deformation of RPCB and FPCB was measured using a KEYENCE LK-G152 laser sensor placed at the entrance and outlet of the reflow oven. Two temperature profiles were used as a variable for the experiment: soaking temperature profile and ramp temperature profile. The investigation shows that component placements pattern influences the deformation of FPCB. The FPCB component placements reduce the deformation due to low wetting angle and component weight. FPCB solder joint has a good wetting angle. | en_US |
dc.publisher | American Institute of Physics Inc. | en_US |
dc.relation | FRGS (203/PMEKANIK/6071489) | en_US |
dc.subject | Flip Chip | en_US |
dc.subject | Ball Grid Arrays | en_US |
dc.subject | Encapsulation | en_US |
dc.title | Effect Of Temperature On Flexible Printed Circuit Board Layout During Reflow Soldering Process | en_US |
dc.type | International | en_US |
dc.relation.conference | AIP Conference Proceedings | en_US |
dc.identifier.doi | 10.1063/5.0126012 | - |
dc.volume | 2680(1) | en_US |
dc.relation.seminar | 4th Tarumanagara International Conference of the Applications of Technology and Engineering, TICATE 2021 | en_US |
dc.description.articleno | 020209 | en_US |
dc.date.seminarstartdate | 2021-08-05 | - |
dc.date.seminarenddate | 2021-08-06 | - |
dc.description.placeofseminar | Virtual | en_US |
dc.description.type | Indexed Proceedings | en_US |
item.grantfulltext | open | - |
item.openairetype | International | - |
item.fulltext | With Fulltext | - |
crisitem.author.dept | Universiti Malaysia Kelantan | - |
Appears in Collections: | Faculty of Bioengineering and Technology - Proceedings |
Files in This Item:
File | Description | Size | Format | |
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1. Effect Of Temperature On Flexible Printed Circuit Board Layout During Reflow Soldering Process.pdf | 205.97 kB | Adobe PDF | View/Open |
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