Please use this identifier to cite or link to this item: http://hdl.handle.net/123456789/3586
DC FieldValueLanguage
dc.contributor.authorAdnan T.M.F.B.T.Men_US
dc.contributor.authorHermawan, A.en_US
dc.date.accessioned2022-12-05T08:34:59Z-
dc.date.available2022-12-05T08:34:59Z-
dc.date.issued2022-
dc.identifier.isbn978-073544193-4-
dc.identifier.issn0094243X-
dc.identifier.urihttp://hdl.handle.net/123456789/3586-
dc.descriptionScopusen_US
dc.description.abstractThe usage of EPS is increasing day by day, especially in the food packaging sector. It is well known that disposal EPS needs a distinct method to process, thus requiring high costs. On the other hand, non-disposed waste EPS caused negatives effects on the environment, such as a severe threat to terrestrial and aquatic life in the long term. Therefore, recycling waste EPS to reduce these environmental problems has become necessary. This study aims to fabricate particleboard by using waste EPS as a binder and evaluating the physical and mechanical properties of the board. For this purpose, particleboards were made from kelempayan wood particles and mixed with different percentages of waste EPS of 10, 20, and 40%. The boards were pressed under 30 tons for 600 seconds at a temperature of 180 °C. The boards were then tested to evaluate the physical properties (moisture content, density, and swelling thickness) and mechanical properties (modulus of rupture, modulus of elasticity, and internal bonding strength) based on the Japanese Industrial Standards for Particleboard (JIS A 5908 Type 8). The results showed that the board made from 40% of waste EPS has the highest mechanical properties than the other boards. In conclusion, waste EPS has the possibility to be used as a binder in particleboard manufacturing.en_US
dc.language.isoenen_US
dc.publisherAmerican Institute of Physics Inc.en_US
dc.subjectEPSen_US
dc.subjectwaste EPSen_US
dc.subjectparticleboarden_US
dc.titleProduction of particleboard by using waste expanded polystyrene (EPS) as binderen_US
dc.typeNationalen_US
dc.relation.conferenceAIP Conference Proceedingsen_US
dc.identifier.doi10.1063/5.0078465-
dc.volume2454en_US
dc.relation.seminar2021 International Conference on Bioengineering and Technology, IConBET2021en_US
dc.description.articleno080013en_US
dc.date.seminarstartdate2022-05-24-
dc.date.seminarenddate2022-05-25-
dc.description.placeofseminarKelantan, Virtualen_US
dc.description.typeIndexed Proceedingsen_US
dc.contributor.correspondingauthorAdnan, Ten_US
item.fulltextNo Fulltext-
item.languageiso639-1en-
item.openairetypeNational-
item.grantfulltextnone-
crisitem.author.deptUniversiti Malaysia Kelantan-
Appears in Collections:Faculty of Bioengineering and Technology - Proceedings
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